4" Copper Bond Flexible Wet Polishing Pads

These Diamond Polishing Pads are full copper bonded diamond polishing pads that will substantially last longer than any resin bond diamond polishing pads on the market.They are designed for fast stock removal on Granite, Marble and Engineered Stone.Although they are full copper pads and 3 mm thick, they are still very flexible for bullnose, radius and bowl use.

Specification

• Size: 4 inch/100 mm.
• Speed: 4500 RPM.
• Grit: #30, #50, #100, #200, #400.
• Usage: wet.
• Material: Copper powder, diamond and resin.
• Thickness: 3.0 mm.
• Application: Granite,Marble,Engineered stone.

Usage

• Use the #30, #50, #100, #200 grit to shape and start the polishing process.
• They will seamlessly switch over to the standard 400 grit polishing pads to finish the polish.
• Use the Copper Bond Polishing Pads to shape and start the polishing process and extend the life of the lower grit polishing pads. After that seamlessly switch over to the standard resin bond wet polishing pads at #400 and finish the polishing process.